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SENIOR/STAFF/PRINCIPAL ENGINEER, PACKAGE SILICON INTEGRATION

Micron is hiring for SENIOR/STAFF/PRINCIPAL ENGINEER, PACKAGE SILICON INTEGRATION in MSB, Singapore. Staff level. First seen October 25, 2026; open as of November 13, 2026. Jobs taken straight from company career pages — no aggregator in between.

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Company
Micron
Where
MSB, Singapore
Level
Staff
First seen
October 25, 2026
Listed via
Workday

What the posting says

Staff Engineer, Package-Silicon Integration As a Staff Engineer, Package-Silicon Integration in Micron’s Package Development Engineering (PDE) organization, you will drive package-silicon integration for next-generation NAND packaging technologies. You will collaborate across silicon design, wafer fabrication, package design, assembly, reliability, and manufacturing to identify and mitigate chip-package interaction risks. You will independently lead complex technical workstreams, develop integration solutions, and leverage AI-enabled and data-driven methods to accelerate engineering learning…

Read more and apply on Micron's site

This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.