Destava

Senior Integration Lead - Advanced Packaging 3DHi and 2.5D

GLOBALFOUNDRIES is hiring for Senior Integration Lead - Advanced Packaging 3DHi and 2.5D in Singapore. On-site, Senior level. First seen November 7, 2026; open as of November 13, 2026. Jobs taken straight from company career pages — no aggregator in between.

Save to applyRead more and apply on GLOBALFOUNDRIES' site

With Destava: How well do you fit? · Tailor my résumé · Write a cover letter

Company
GLOBALFOUNDRIES
Where
Singapore
Arrangement
On-site
Level
Senior
First seen
November 7, 2026
Listed via
Workday

What the posting says

Summary of Role: The CMOS product team is seeking a Singapore-based Senior Advanced Packaging 3DHi and2.5D Integration Lead to join GlobalFoundries’ local technology development organization. Based at our Singapore site, this lead integrator will define and drive advanced packaging technology development from architecture and early process demonstration through qualification, manufacturing transfer, and production readiness. The successful candidate will bring deep, hands-on expertise in 3D heterogeneous integration (3DHi) and 2.5D solutions, including chiplet integration, silicon…

Read more and apply on GLOBALFOUNDRIES' site

This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.