Principal Engineer / MTS, PDE Package Design
Micron is hiring for Principal Engineer / MTS, PDE Package Design in MSB, Singapore. Staff level. First seen October 8, 2026; open as of November 11, 2026. Jobs taken straight from company career pages — no aggregator in between.
With Destava: How well do you fit? · Tailor my résumé · Write a cover letter
- Company
- Micron
- Where
- MSB, Singapore
- Level
- Staff
- First seen
- October 8, 2026
- Listed via
- Workday
What the posting says
Responsibilities - Own package architecture and execution from feasibility through tape-out, qualification, and production readiness, ensuring design intent is translated into manufacturable, reliable, and scalable solutions. - Serve as the technical authority for complex package issues, leading cross-functional reviews, trade-off decisions, and risk closure across product, silicon, technology, assembly, quality, supplier, and OSAT teams. Balance performance, reliability, manufacturability, cost, quality, and schedule to deliver production-ready solutions while mentoring engineers through…
Read more and apply on Micron's site
More jobs like this
Autonomous Vehicle Hardware Intern
Save to applyStaff/Snr Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering
Save to applySenior Engineer - Firmware Development (SSD)
Save to applySenior Firmware System Engineer
Save to apply
See all 52 Computer Hardware Engineers jobs in Singapore
A search agent finds the jobs this list misses: the ones that mean the same without the same words. Have Destava watch for principal engineer / mts, pde package design jobs in MSB, Singapore, new matches every morning on your own account.
This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.