ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

Company

Micron

Where

MSB, Singapore

Level

Mid

First seen

September 18, 2026

Postings

2

Listed via

Workday

What the posting says

We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing. The position partners closely with stakeholders such as Development Team & Manufacturing and supplier teams across Micron’s global network. Main Responsibilities - Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness. -…

Read more and apply on Micron's site

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