Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Company

Micron

Where

Fab 10A, Singapore

Level

Staff

First seen

September 16, 2026

Listed via

Workday

What the posting says

Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future . Main Responsibilities: Process Development: - Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and…

Read more and apply on Micron's site

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