Intern - Package Development Engineering
Micron is hiring for Intern - Package Development Engineering in MSB, Singapore. Intern level. First seen November 7, 2026; open as of November 9, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Micron
- Where
- MSB, Singapore
- Level
- Intern
- First seen
- November 7, 2026
- Listed via
- Workday
What the posting says
Skillsets Required - Strong analytical and problem-solving skills. - Comfortable working with engineering data. - Familiarity with Excel, Python, Power BI , or similar analytical tools is preferred. - Interest in semiconductor technology, advanced packaging, manufacturing, AI, or data analytics. - Curious, self-driven, and willing to learn in a fast-paced engineering environment. - Good communication skills and ability to work across technical disciplines. Course of Interest Students currently pursuing a Bachelor’s or Master’s degree in: - Electrical / Electronic Engineering - Mechanical…
Read more and apply on Micron's site
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