Destava

Principal Product Engineer (AI/ML & Advanced Data Analytics Lead), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering

Micron is hiring for Principal Product Engineer (AI/ML & Advanced Data Analytics Lead), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering in Fab 10A, Singapore. Manager level. First seen September 25, 2026; open as of November 11, 2026. Jobs taken straight from company career pages — no aggregator in between.

Save to applyRead more and apply on Micron's site

With Destava: How well do you fit? · Tailor my résumé · Write a cover letter

Company
Micron
Where
Fab 10A, Singapore
Level
Manager
First seen
September 25, 2026
Listed via
Workday

What the posting says

As part of the HIG HBM Product and System Engineering organization, you will be leading a team of engineers building the predictive models that determine how HBM is screened, dispositioned, and tested in high-volume manufacturing. In this role, you will work on intelligent systems that improve engineering productivity, strengthen technical decision-making, and unlock insights from complex manufacturing, validation, and engineering workflows. You will collaborate with cross-functional teams across Product and System Engineering, Design Engineering, Test Engineering, Data Science, IT, and…

Read more and apply on Micron's site

This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.