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Principal Thin Films Engineer, Advanced Packaging

Micron is hiring for Principal Thin Films Engineer, Advanced Packaging in Boise, ID - Main Site. Staff level. First seen October 6, 2026; open as of November 11, 2026. Jobs taken straight from company career pages — no aggregator in between.

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Company
Micron
Where
Boise, ID - Main Site
Level
Staff
First seen
October 6, 2026
Listed via
Workday

What the posting says

We are seeking an experienced Process Engineer with expertise in depositing thin films who will thrive in a fast paced and results oriented environment! Our goal is to employ robust solutions to thin film challenges that meet the detailed physical and electrical requirements for Micron’s industry-leading memory products. In this role, you will develop and optimize novel solutions to film deposition challenges for the next generations of Micron’s memory systems. You will to take ideas from conception through development and implementation in manufacturing. Best-qualified candidates will have…

Read more and apply on Micron's site

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