Microelectronics Assembler – Hybrid Thick-Film
UEC Electronics, LLC is hiring for Microelectronics Assembler – Hybrid Thick-Film in Rochester, NY. Junior level. First seen October 17, 2026; open as of November 8, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- UEC Electronics, LLC
- Where
- Rochester, NY
- Level
- Junior
- First seen
- October 17, 2026
- Listed via
- Paylocity
What the posting says
Description Position Summary The Microelectronics Assembler performs precision assembly and processing of hybrid thick-film microelectronic components in a Class 10K cleanroom environment. This position involves working with delicate, lightweight components and ceramic substrates using microscopes, precision tools, and specialized manufacturing equipment. The ideal candidate has strong manual dexterity, excellent attention to detail, and the ability to follow detailed work instructions while maintaining high standards of workmanship and quality. Experience in microelectronics or precision…
Read more and apply on UEC Electronics, LLC's site
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