Destava

Packaging Engineer Intern Spring 2027

Printpack is hiring for Packaging Engineer Intern Spring 2027 in Atlanta, GA. Intern level. First seen October 28, 2026; open as of November 12, 2026. Jobs taken straight from company career pages — no aggregator in between.

Save to applyRead more and apply on Printpack's site

With Destava: How well do you fit? · Tailor my résumé · Write a cover letter

Company
Printpack
Where
Atlanta, GA
Level
Intern
First seen
October 28, 2026
Listed via
Workday

What the posting says

Packaging Engineer Intern Printpack’s Technology and Innovation team is seeking a Packaging Engineer Intern for Spring 2027 (January 2027-June 2027) . This internship will provide a unique opportunity to work directly with Product Development designing next generation packaging solutions, with Manufacturing personnel utilizing state of the art equipment, and with Sales and Marketing professionals creating strategic growth platforms. This is a full-time position located in Atlanta, GA and will report to a Product Development Manager. This is a great opportunity to get hands-on experience…

Read more and apply on Printpack's site

This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.