Internship - Design of a compact solder joint resistance sensor
NXP is hiring for Internship - Design of a compact solder joint resistance sensor in Eindhoven. Intern level. First seen October 31, 2026; open as of November 13, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- NXP
- Where
- Eindhoven, Nijmegen
- Level
- Intern
- First seen
- October 31, 2026
- Listed via
- Workday
What the posting says
A compact solder joint resistance sensor with 200mΩ range and 100μΩ resolution For safety-critical automotive and robotics applications physical health sensing and failure-prediction are required to meet stringent reliability requirements. To detect and predict a failure[1] in the PCB interconnect interface of a chip requires accurate on-chip measurement of the solder-joint resistance. The challenges associated with the on-chip solder-joint measurement are besides the small resistance range of 200mΩ, required resolution of 100μΩ the accuracy over time and limited force current. Previous work…
Read more and apply on NXP's site
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