Intern - Next-Generation HBM Architecture
Micron is hiring for Intern - Next-Generation HBM Architecture in Folsom, CA. Intern level. First seen October 6, 2026; open as of November 11, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Micron
- Where
- Folsom, CA
- Level
- Intern
- First seen
- October 6, 2026
- Listed via
- Workday
What the posting says
As a Memory Systems Architecture Intern, you will contribute to the architecture and microarchitecture development of future HBM products. You will work alongside experienced architects to evaluate new memory features, analyze architectural trade-offs, develop performance models, and explore solutions that improve memory performance, reliability, and efficiency for AI and high-performance computing workloads. Responsibilities - Research and evaluate next-generation HBM architecture and microarchitecture features, including memory scheduling, refresh management, reliability features, thermal…
Read more and apply on Micron's site
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