Principal Engineer – 3D NAND Process Integration
Micron is hiring for Principal Engineer – 3D NAND Process Integration in Fab 10N/X, Singapore. Staff level. First seen September 23, 2026; open as of November 11, 2026. Jobs taken straight from company career pages — no aggregator in between.
With Destava: How well do you fit? · Tailor my résumé · Write a cover letter
- Company
- Micron
- Where
- Fab 10N/X, Singapore
- Level
- Staff
- First seen
- September 23, 2026
- Listed via
- Workday
What the posting says
In this role, you will work in a cutting-edge R&D environment, developing next-generation memory technologies by bridging device concepts, materials, and process integration into manufacturable solutions. You will leverage AI-enabled data analytics and model-driven methodologies to analyze complex datasets, accelerate learning cycles, and solve critical scaling challenges, directly impacting future memory nodes. Key Responsibilities - Drive 3D NAND integration and technology roadmap , leading pathfinding and advanced architecture enablement. - Lead end-to-end development (conception →…
Read more and apply on Micron's site
More jobs like this
A search agent finds the jobs this list misses: the ones that mean the same without the same words. Have Destava watch for principal engineer – 3d nand process integration jobs in Fab 10N/X, Singapore, new matches every morning on your own account.
This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.