Intern - Advanced Packaging TD
Micron is hiring for Intern - Advanced Packaging TD in Boise, ID - Main Site. Intern level. First seen November 4, 2026; open as of November 12, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Micron
- Where
- Boise, ID - Main Site
- Level
- Intern
- First seen
- November 4, 2026
- Listed via
- Workday
What the posting says
As an Advanced Package TD Process Intern, you will collaborate with experienced engineers to support development of technologies including hybrid bonding, micro bump technology, Through-Silicon Vias (TSV), and thermal management. You will gain hands-on experience in structured problem-solving, line monitoring, data analysis, experimental design, and project management while contributing to process optimization and yield improvement. You will also leverage AI and Code Assist to develop Agent-based solutions that support engineering analysis and process development activities. Responsibilities…
Read more and apply on Micron's site
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