Destava

HBM PYE Product Development Failure Analysis Engineer

Micron is hiring for HBM PYE Product Development Failure Analysis Engineer in Boise, ID - Main Site. Staff level. First seen November 4, 2026; open as of November 11, 2026. Jobs taken straight from company career pages — no aggregator in between.

Save to applyRead more and apply on Micron's site

With Destava: How well do you fit? · Tailor my résumé · Write a cover letter

Company
Micron
Where
Boise, ID - Main Site
Level
Staff
First seen
November 4, 2026
Listed via
Workday

What the posting says

Micron in Boise, Idaho has an opening for a HBM Product Yield Enhancement PDFA Engineer where you will work on the Product Development Failure Analysis team to take next generation HBM devices from design to mass production! This role can be entry level with a Master's Degree or equivalent experience, Senior level, or Staff level. As part of the HBM Product Development Failure Analysis (PDFA) team, you will play a meaningful role in bringing next-generation HBM products from design through qualification and into high production manufacturing. The team focuses on ensuring product reliability,…

Read more and apply on Micron's site

This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.