Destava

Advanced Packaging Intern

Marvell India Pvt Ltd, Bangalore is hiring for Advanced Packaging Intern in Bangalore. Intern level. First seen October 28, 2026; open as of November 13, 2026. Jobs taken straight from company career pages — no aggregator in between.

Save to applyRead more and apply on Marvell India Pvt Ltd, Bangalore's site

With Destava: How well do you fit? · Tailor my résumé · Write a cover letter

Company
Marvell India Pvt Ltd, Bangalore
Where
Bangalore
Level
Intern
First seen
October 28, 2026
Listed via
Workday

What the posting says

What You Can Expect .Strong foundational understanding of package design, including design rules, breakout, place and route, signal shielding, reference planes, powerdistribution, and pinout optimization across package and system requirements. Solid grasp of SI/PI fundamentals at the substrate, board, and system levels; familiarity with running and interpreting signal and power simulations isa plus. Knowledge of 2D, 2.5D, and emerging packaging architectures such as CoWoS‑S/R/L, EMIB, CPO, and CPC. High‑level understanding of thermal and mechanical package constraints (e.g., warpage, TIM).…

Read more and apply on Marvell India Pvt Ltd, Bangalore's site

This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.