(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)
Renesas Electronics is hiring for (Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried) in Taichung, Taichung City, Taiwan. Senior level. First seen October 9, 2026; open as of November 10, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Renesas Electronics
- Where
- Taichung, Taichung City, Taiwan
- Level
- Senior
- First seen
- October 9, 2026
- Listed via
- SmartRecruiters
Read more and apply on Renesas Electronics' site
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