Destava

Mechanical Packaging Systems Engineering Intern (Summer 2027)

Foth is hiring for Mechanical Packaging Systems Engineering Intern (Summer 2027) in Green Bay, Wisconsin. Intern level. First seen September 4, 2026; open as of November 12, 2026. Jobs taken straight from company career pages — no aggregator in between.

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Company
Foth
Where
Green Bay, Wisconsin
Level
Intern
First seen
September 4, 2026
Listed via
Lever

What the posting says

As a Mechanical Engineering Intern on our Packaging Systems Team, you'll gain hands-on experience supporting the design and optimization of packaging systems for a variety of industrial clients. Based in Green Bay, WI, you'll work with multidisciplinary teams on projects involving packaging equipment, automation technologies, material handling systems, and production line improvements. During this Summer 2027 internship, you'll develop technical and professional skills while gaining valuable insight into engineering design, project development, and industry best practices. Primary…

Read more and apply on Foth's site

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