Destava

Lead Packaging Systems Engineer

Foth is hiring for Lead Packaging Systems Engineer in Green Bay, Wisconsin. Senior level. First seen September 26, 2026; open as of November 10, 2026. Jobs taken straight from company career pages — no aggregator in between.

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Company
Foth
Where
Green Bay, Wisconsin
Level
Senior
First seen
September 26, 2026
Listed via
Lever

What the posting says

In this role, you will lead and support the mechanical design efforts on paper converting and packaging systems projects, ensuring the execution of capital projects within defined scopes, costs, and schedules. Your expertise will be crucial in developing concepts, preparing detailed design packages, and interfacing with clients and vendors. If you are passionate about engineering excellence and thrive in a collaborative environment, we invite you to consider Foth! Primary Responsibilities: Lead and support the mechanical design effort on converting and packaging line projects. Execute…

Read more and apply on Foth's site

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