Die Attach Manufacturing Engineer- Process & Equiment
Lumilens is hiring for Die Attach Manufacturing Engineer- Process & Equiment in Singapore. Senior level. First seen August 6, 2026; open as of November 12, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Lumilens
- Where
- Singapore
- Level
- Senior
- First seen
- August 6, 2026
- Listed via
- Ashby
What the posting says
In this mid-to-senior level role, you will lead the development, qualification, optimization, and sustaining of die attach processes and equipment for Photonic Integrated Circuits (PICs), silicon photonics dies, and co-packaged optical/electronic modules. This position is responsible for achieving sub-micron placement accuracy and optical-grade attach quality through active/passive alignment die bonding, epoxy/adhesive dispense, eutectic/AuSn solder attach, and flip-chip bonding. You will ensure high optical coupling yield, mechanical/thermal reliability, and operational throughput, while…
Read more and apply on Lumilens' site
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This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.