Destava

Advanced Package Technology Principal Engineer

Lumilens is hiring for Advanced Package Technology Principal Engineer in San Jose. Staff level. First seen August 6, 2026; open as of November 12, 2026. Jobs taken straight from company career pages — no aggregator in between.

Save to applyRead more and apply on Lumilens' site

With Destava: How well do you fit? · Tailor my résumé · Write a cover letter

Company
Lumilens
Where
San Jose
Level
Staff
First seen
August 6, 2026
Listed via
Ashby

What the posting says

We are seeking an experienced IC Package Mechanical FEA Engineer to help drive the next generation of high‑performance packaging solutions for advanced ASICs. In this role, you will join a globally distributed R&D organization developing mechanical designs that enable cutting‑edge systems for AI, networking, HPC, and 5G infrastructure. You will work hands‑on with emerging packaging and photonic‑integration technologies, including co‑packaged fiber‑optic transceivers, novel optical connectors, and complex chip‑stacking approaches such as 3DIC, hybrid copper bonding, and heterogeneous…

Read more and apply on Lumilens' site

This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.