Process Engineer (Die Attach / Wire Bond / Active Alignment / Overall Line)
Lumilens is hiring for Process Engineer (Die Attach / Wire Bond / Active Alignment / Overall Line) in Bulim Square. Mid level. First seen August 18, 2026; open as of November 10, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Lumilens
- Where
- Bulim Square
- Level
- Mid
- First seen
- August 18, 2026
- Listed via
- Ashby
What the posting says
In this role, you will be responsible for process development, qualification, yield optimization, and continuous improvement across microelectronics packaging, optical module assembly, and high-precision automation lines. We are hiring across multiple domain specializations: - Die Attach (DB / Die Bond) - Wire Bond (WB) - Active Alignment (AA / Optical Alignment) - Process Engineering – Overall / Integration Key Responsibilities - Process Setup & Optimization: Establish robust process windows, parameter recipes, and standard operating procedures (SOPs) for assigned production modules (DB,…
Read more and apply on Lumilens' site
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