Wire Bond-Manufacturing Engineer
Lumilens is hiring for Wire Bond-Manufacturing Engineer in Singapore. Mid level. First seen August 6, 2026; open as of November 10, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Lumilens
- Where
- Singapore
- Level
- Mid
- First seen
- August 6, 2026
- Listed via
- Ashby
What the posting says
In this mid-to-senior level role, you will be responsible for developing, qualifying, optimizing, and sustaining wire bonding processes and equipment for semiconductor packaging operations. You will oversee process and equipment performance for ball bonding, wedge bonding, and ribbon bonding operations, ensuring high yield, reliability, and throughput, while driving continuous improvement and supporting new product introduction (NPI). KEY RESPONSIBILITIES Process Engineering - Develop, characterize, qualify, and optimize wire bond processes (thermosonic ball bonding, wedge bonding, ribbon…
Read more and apply on Lumilens' site
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