Senior/Staff Process Engineer (Wafer Dicing & Back-grind)
Lumilens is hiring for Senior/Staff Process Engineer (Wafer Dicing & Back-grind) in Singapore. Staff level. First seen August 6, 2026; open as of November 12, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Lumilens
- Where
- Singapore
- Level
- Staff
- First seen
- August 6, 2026
- Listed via
- Ashby
What the posting says
Core Responsibilities - Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line. - Optimize wafer thinning thickness, grinding speed, cutting path and laser cutting parameters to avoid chip crack, edge chipping and optical structure damage of silicon photonic wafers. - Solve process abnormalities in wafer thinning and dicing processes, including wafer warpage, surface scratch, incomplete cutting and chip breakage. - Monitor wafer thickness uniformity, cutting…
Read more and apply on Lumilens' site
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