Substrate IC Package Layout Design Engineer
Etched is hiring for Substrate IC Package Layout Design Engineer in Taipei. Mid level. First seen September 18, 2026; open as of November 11, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Etched
- Where
- Taipei
- Level
- Mid
- First seen
- September 18, 2026
- Listed via
- Ashby
What the posting says
Job Summary As a Substrate IC Package Layout Design Engineer you will be responsible for the end-to-end design of complex IC substrate packages, supporting high-power consumption and high-speed signaling. The ideal candidate will have extensive experience with large substrate designs (>50mm), complex power delivery networks, and high-speed signaling solutions (up to and beyond 50GHz). You will work closely with silicon, signal integrity, power integrity, and system help co-design world class substates with OSAT providers. Intense focus on optimization for power delivery through substrate,…
Read more and apply on Etched's site
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