Advanced Packaging & Integration Lead
Equal1 is hiring for Advanced Packaging & Integration Lead in Dublin. Senior level. First seen September 22, 2026; open as of November 11, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Equal1
- Where
- Dublin
- Level
- Senior
- First seen
- September 22, 2026
- Listed via
- Ashby
What the posting says
In this role, you will work with a multidisciplinary team to drive the R&D of complex multi-chip modules utilising TSVs and micro-bumps, optimised for operation at millikelvin temperatures. You will have a significant influence on the physical architecture of next-generation quantum processors, shaping how advanced packaging subsystems integrate into the overall quantum computing solution. MAIN DUTIES AND RESPONSIBILITIES - Drive the high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules. - Develop advanced packaging solutions using TSVs,…
Read more and apply on Equal1's site
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