Destava

Senior Packaging Engineer

Arago is hiring for Senior Packaging Engineer in Paris Offices. Senior level. First seen August 6, 2026; open as of November 9, 2026. Jobs taken straight from company career pages — no aggregator in between.

Save to applyRead more and apply on Arago's site

With Destava: How well do you fit? · Tailor my résumé · Write a cover letter

Company
Arago
Where
Paris Offices
Level
Senior
First seen
August 6, 2026
Listed via
Ashby

What the posting says

WHAT YOU’LL DO As a Senior Packaging Engineer, you will lead IC packaging initiatives from conceptualization and design to manufacturing process selection. You will establish the necessary supply chain, manage sub-contractors, and oversee the NPI and ramp-up phases for current and future Arago devices. REQUIRED SKILLS AND EXPERIENCE - Master's degree in Electrical Engineering or Integrated Circuits Design. - 5+ years of experience in the semiconductor and photonic packaging industry. - Proficiency in heterogeneous integration and packaging processes, including wafer dicing (stealth, blade,…

Read more and apply on Arago's site

This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.