Destava

Substrate IC Package Layout Design Engineer (Taiwan)

Etched is hiring for Substrate IC Package Layout Design Engineer (Taiwan) in Taipei. Mid level. First seen November 7, 2026; open as of November 12, 2026. Jobs taken straight from company career pages — no aggregator in between.

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Company
Etched
Where
Taipei
Level
Mid
First seen
November 7, 2026
Listed via
Ashby

What the posting says

Job Summary As a Substrate IC Package Layout Design Engineer you will be responsible for the end-to-end design of complex IC substrate packages, supporting high-power consumption and high-speed signaling. The ideal candidate will have extensive experience with large substrate designs (>50mm), complex power delivery networks, and high-speed signaling solutions (up to and beyond 50GHz). You will work closely with silicon, signal integrity, power integrity, and system help co-design world class substates with OSAT providers. Intense focus on optimization for power delivery through substrate,…

Read more and apply on Etched's site

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