Manufacturing Engineer Packaging & OSAT
Tenstorrent is hiring for Manufacturing Engineer Packaging & OSAT in 新北市, New Taipei City, Taiwan. Mid level. First seen September 17, 2026; open as of November 13, 2026. Jobs taken straight from company career pages — no aggregator in between.
With Destava: How well do you fit? · Tailor my résumé · Write a cover letter
- Company
- Tenstorrent
- Where
- 新北市, New Taipei City, Taiwan
- Level
- Mid
- First seen
- September 17, 2026
- Listed via
- Greenhouse
What the posting says
Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. You will work closely with Packaging Engineering, Silicon Manufacturing and Test, Quality, Supply Chain, PCB/board design, and external partners such as substrate suppliers, OSATs, test houses, and contract…
Read more and apply on Tenstorrent's site
More jobs like this
A search agent finds the jobs this list misses: the ones that mean the same without the same words. Have Destava watch for manufacturing engineer packaging & osat jobs in 新北市, New Taipei City, Taiwan, new matches every morning on your own account.
This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.