Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)
Samsung Semiconductor is hiring for Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM) in San Jose, California, United States. Intern level. First seen October 28, 2026; open as of November 13, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Samsung Semiconductor
- Where
- San Jose, California, United States
- Level
- Intern
- First seen
- October 28, 2026
- Listed via
- Greenhouse
What the posting says
As an intern you will own one piece of this platform end to end: from the physics and the CFD reference to a validated model that architecture, power, and package teams use to make design decisions. Skills You’ll Learn: Heat conduction in 3D-stacked die: TSV arrays, micro-bumps, underfill, and anisotropic effective properties Compact and reduced-order thermal modeling CFD modeling and validation with Simcenter Flotherm Scientific computing at scale: sparse solvers, preconditioning, and fast Python/MATLAB code Power-thermal co-simulation and thermal-aware design of AI memory systems What…
Read more and apply on Samsung Semiconductor's site
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