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Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)

Samsung Semiconductor is hiring for Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM) in San Jose, California, United States. Intern level. First seen October 28, 2026; open as of November 13, 2026. Jobs taken straight from company career pages — no aggregator in between.

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Company
Samsung Semiconductor
Where
San Jose, California, United States
Level
Intern
First seen
October 28, 2026
Listed via
Greenhouse

What the posting says

As an intern you will own one piece of this platform end to end: from the physics and the CFD reference to a validated model that architecture, power, and package teams use to make design decisions. Skills You’ll Learn: Heat conduction in 3D-stacked die: TSV arrays, micro-bumps, underfill, and anisotropic effective properties Compact and reduced-order thermal modeling CFD modeling and validation with Simcenter Flotherm Scientific computing at scale: sparse solvers, preconditioning, and fast Python/MATLAB code Power-thermal co-simulation and thermal-aware design of AI memory systems What…

Read more and apply on Samsung Semiconductor's site

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