Silicon Packaging Design Architect
Intel is hiring for Silicon Packaging Design Architect in US, Arizona, Phoenix. Staff level. First seen October 7, 2026; open as of November 10, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Intel
- Where
- US, Arizona, Phoenix
- Level
- Staff
- First seen
- October 7, 2026
- Listed via
- Workday
What the posting says
In this senior engineering role, you will collaborate with cross-functional teams to design, troubleshoot, and continuously improve packaging standards and processes, ensuring high-quality package output. Your contributions will directly impact the seamless transition of designs to production and enhance Intel's advanced packaging technologies. Business Group As part of Intel Corporation's dynamic and innovative ecosystem, this role resides within the Silicon Packaging Architecture team, focused on developing advanced packaging solutions that enable Intel's cutting-edge silicon technologies.…
Read more and apply on Intel's site
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