Destava

Engineer - 6G RF Packaging

Huawei Technologies Canada Co., Ltd. is hiring for Engineer - 6G RF Packaging in Ottawa, Ontario, Canada. Mid level. First seen September 12, 2026; open as of November 6, 2026. Jobs taken straight from company career pages — no aggregator in between.

Save to applyRead more and apply on Huawei Technologies Canada Co., Ltd.'s site

With Destava: How well do you fit? · Tailor my résumé · Write a cover letter

Company
Huawei Technologies Canada Co., Ltd.
Where
Ottawa, Ontario, Canada
Level
Mid
First seen
September 12, 2026
Listed via
Recruitee

What the posting says

The total target annual compensation for this position ranges from $104,000 to $154,000 depending on education, experience, and demonstrated expertise. About the ideal candidate: 5 years of relevant industry experiences. PhD in Electrical Engineering, RF/Microwave Engineering, Packaging, or a related field (or equivalent advanced R&D experience). Deep knowledge of RF/microwave principles. Experience using full-wave EM and circuit simulation tools to model packages and correlate results with measure. Hands-on experience designing test vehicles and directing microelectronics assembly (e.g.,…

Read more and apply on Huawei Technologies Canada Co., Ltd.'s site