MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer
GLOBALFOUNDRIES is hiring for MTS - Advanced Packaging 2.5D and Deep Trench Integration Engineer in Singapore. On-site, Staff level. First seen November 4, 2026; open as of November 12, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- GLOBALFOUNDRIES
- Where
- Singapore
- Arrangement
- On-site
- Level
- Staff
- First seen
- November 4, 2026
- Listed via
- Workday
What the posting says
Summary of Role: The CMOS product team is seeking a Singapore-based Advanced Packaging 2.5D and Deep Trench Integration Engineer to join GlobalFoundries’ local technology development organization. Based at our Singapore site, this engineer will support and drive integration activities for 2.5D solutions and deep trench (DT) technologies from early process development and test-vehicle execution through qualification and manufacturing readiness. The successful candidate will bring practical experience in semiconductor process integration, with expertise in deep trench structures and relevant…
Read more and apply on GLOBALFOUNDRIES' site
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