IC Packaging Design & Layout Engineer
The Charles Stark Draper Laboratory is hiring for IC Packaging Design & Layout Engineer in Cambridge, MA. Mid level, $82k–$220k a year stated. First seen November 13, 2026; open as of November 14, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- The Charles Stark Draper Laboratory
- Where
- Cambridge, MA
- Level
- Mid
- Pay stated
- $82k–$220k a year
- First seen
- November 13, 2026
- Listed via
- Workday
What the posting says
Job Description Summary: The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced integrated circuit (IC) packaging solutions that meet performance, power, size, and reliability targets for Draper’s next generation hardware platforms. The role requires deep technical expertise in package architecture, high speed layout, signal integrity analysis, and design for manufacturability (DFM). The engineer will collaborate with cross functional teams—including silicon design, thermal/mechanical analysts, and manufacturing—to deliver manufacturable package…
Read more and apply on The Charles Stark Draper Laboratory's site
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