Package Design Engineer
broadcom is hiring for Package Design Engineer in Singapore-Yishun. Mid level. First seen September 10, 2026; open as of November 12, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- broadcom
- Where
- Singapore-Yishun
- Level
- Mid
- First seen
- September 10, 2026
- Listed via
- Workday
What the posting says
Job Description: Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 200G and higher, RF/Microwave ADC/DAC, DDR, HBM, and more. You'll have the opportunity to collaborate with the team to create the package…
Read more and apply on broadcom's site
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