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R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization

broadcom is hiring for R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization in Germany-Regensburg. Mid level. First seen October 29, 2026; open as of November 8, 2026. Jobs taken straight from company career pages — no aggregator in between.

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Company
broadcom
Where
Germany-Regensburg
Level
Mid
First seen
October 29, 2026
Listed via
Workday

What the posting says

Job Description: Development of device testing at wafer level, die level and module level More specific duties include the following: - Definition of test requirements and test methods for our optoelectronic transceiver and sensor products as well as for our in-house mixed signal ASICs and sensor chips, which are used within these products. - Development, bring up and debugging test hardware and software for evaluation, device characterization (bench) and production testing. This can be either completely in-house or in cooperation with external engineering partners. - Design of test…

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