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Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Subject Matter Expert)

The Boeing Company is hiring for Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Subject Matter Expert) in USA - El Segundo, CA. Staff level, $146k–$198k a year stated. First seen November 8, 2026; open as of November 11, 2026. Jobs taken straight from company career pages — no aggregator in between.

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Company
The Boeing Company
Where
USA - El Segundo, CA
Level
Staff
Pay stated
$146k–$198k a year
First seen
November 8, 2026
Listed via
Workday

What the posting says

As a Space Electronics Packaging Design and Analysis Engineer, you will play a pivotal role in shaping the future of space exploration with us. We offer an unparalleled opportunity to be part of a team that conducts full in-house cradle-to-grave work, providing you with a unique and fulfilling experience. From the moment you step through our doors, you will have the chance to contribute to every stage of the product lifecycle, from initial design concepts to prototyping and final production. This includes mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration…

Read more and apply on The Boeing Company's site

This page includes information from the O*NET 31.0 Database by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA). Used under the CC BY 4.0 license. O*NET® is a trademark of USDOL/ETA.