Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis)
SpaceX is hiring for Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis) in Bastrop, TX. Mid level. First seen November 3, 2026; open as of November 13, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- SpaceX
- Where
- Bastrop, TX
- Level
- Mid
- First seen
- November 3, 2026
- Listed via
- Greenhouse
What the posting says
We are looking for a hands-on Process Engineer to develop, optimize, qualify, and implement advanced IC assembly processes, with a focus on Gold-to-Gold Interconnect (GGI) and thermosonic flip-chip bonding. You will take processes from early prototype through production ramp, working directly with equipment and with package engineering, design, manufacturing, reliability, materials, and supply-chain partners. RESPONSIBILITIES Develop and qualify GGI and thermosonic flip-chip / die-attach processes, including bond force, temperature, ultrasonic energy, bond time, alignment, parallelism, and…
Read more and apply on SpaceX's site
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