Package Design Engineer
SPD Technology is hiring for Package Design Engineer in Israel. Remote, Mid level. First seen October 15, 2026; open as of November 6, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- SPD Technology
- Where
- Israel
- Arrangement
- Remote
- Level
- Mid
- First seen
- October 15, 2026
- Listed via
- Workable
What the posting says
You will contribute to technologies used at massive global scale, helping shape future hardware platforms with a strong focus on performance, efficiency, reliability, and system-level integration. As a Chip Package Designer within the Silicon Integration team, you will develop package substrate designs for advanced 2.5D/3.5D packaging technologies used in high-performance ML and AI chips. You will collaborate closely with Signal Integrity/Power Integrity (SI/PI), Thermal/Mechanical, Assembly, and PCB engineering teams to develop complex, high-performance substrate designs. The primary…
Read more and apply on SPD Technology's site
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