Physics AI - Thermal-Mechanical Reliability
Flexcompute Inc. is hiring for Physics AI - Thermal-Mechanical Reliability in Watertown, Massachusetts, United States. Mid level. First seen August 9, 2026; open as of November 5, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Flexcompute Inc.
- Where
- Watertown, Massachusetts, United States
- Level
- Mid
- First seen
- August 9, 2026
- Listed via
- Workable
What the posting says
Flexcompute is seeking a visionary technical leader to head our new division focused on 3D-IC Thermal-Mechanical Reliability. In this role, you will be the primary architect of how we apply our world’s fastest GPU solvers and Physics AI Foundation Models to the semiconductor industry’s most critical bottleneck: the structural and thermal integrity of advanced packaging. You will lead the strategy for solving high-stakes issues such as warpage, CTE mismatch, and thermal-induced stress in 3D-ICs and chiplet architectures. You aren’t just using tools; you are defining the future of how AI and…
Read more and apply on Flexcompute Inc.'s site
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