Head of Device Fabrication, Advanced Packaging and Assembly
Universal Quantum is hiring for Head of Device Fabrication, Advanced Packaging and Assembly in Singapore. Remote, Executive level. First seen September 29, 2026; open as of November 6, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- Universal Quantum
- Where
- Singapore
- Arrangement
- Remote
- Level
- Executive
- First seen
- September 29, 2026
- Listed via
- Workable
What the posting says
Based in Singapore, the role leads a global organisation across Singapore and Japan and manages strategic relationships with semiconductor foundries, outsourced semiconductor assembly and test providers, and specialist package and materials suppliers. The position combines deep technical leadership, external partner management, organisational development, and programme delivery. It owns the research and development roadmap from early process concepts through qualified, repeatable manufacturing solutions, ensuring close alignment with Systems Engineering, Device Design, Product, and…
Read more and apply on Universal Quantum's site
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