Group Leader – Wire Bond & Mold
3D Glass Solutions is hiring for Group Leader – Wire Bond & Mold in Bhubaneswar, Odisha. Manager level. First seen September 29, 2026; open as of November 7, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- 3D Glass Solutions
- Where
- Bhubaneswar, Odisha
- Level
- Manager
- First seen
- September 29, 2026
- Listed via
- BambooHR
What the posting says
Job/Position Summary The Group Leader – Wire Bond & Mold is responsible for leading development, optimization, qualification, and manufacturing support activities for plasma treatment, wire bonding, compression and transfer molding, post-mold cure, deflash, and laser marking processes used in advanced semiconductor assembly. The role focuses on achieving robust interconnect and encapsulation performance with emphasis on bond strength and consistency, loop control, mold fill, package warpage, defect reduction, and high manufacturing yield. This position plays a key leadership role in…
Read more and apply on 3D Glass Solutions' site
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