Group Leader – Die Attach & Underfill
3D Glass Solutions is hiring for Group Leader – Die Attach & Underfill in Bhubaneswar, Odisha. Manager level. First seen September 29, 2026; open as of November 7, 2026. Jobs taken straight from company career pages — no aggregator in between.
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- Company
- 3D Glass Solutions
- Where
- Bhubaneswar, Odisha
- Level
- Manager
- First seen
- September 29, 2026
- Listed via
- BambooHR
What the posting says
Job/Position Summary The Group Leader – Die Attach & Underfill is responsible for leading development, optimization, qualification, and manufacturing support activities for flip chip die attach, epoxy and film die attach, mass reflow, flux cleaning, plasma treatment, capillary underfill, and cure processes used in advanced semiconductor assembly. The role focuses on achieving robust interconnect and underfill performance with emphasis on placement accuracy, solder joint integrity, underfill flow and void control, adhesion, defect reduction, and high manufacturing yield. This position plays a…
Read more and apply on 3D Glass Solutions' site
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